Low Melting Point Glass Powder -(350°~900°C Melting)
Low Melting Point Glass Powder -(350°~900°C Melting)

Low Melting Point Glass Powder -(350°~900°C Melting)

Origin: Foshan, China
Product name: Low melting point glass powder 11
Temperature: 350-520℃
Microscopic appearance: spheroidal crystal
Used for: Used as adhesive
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Description

Low melting point glass powder 11

Origin: Foshan, China
Product name: Low melting point glass powder 11
Temperature: 350-520℃
Microscopic appearance: spheroidal crystal
Used for: Used as adhesive

 

Performance characteristics

 

(1) Low-temperature melting property: Low-melting-point glass powder can melt into a liquid state with a certain viscosity at a relatively low temperature, which can effectively reduce energy consumption during processing and avoid excessive thermal impact on the bonded material.

 

(2) Chemical stability: It has good chemical inertness and is not easy to react chemically with water, organic solvents, acids, alkalis and other substances. It can remain stable in different chemical environments and is not easy to be corroded or decomposed, ensuring the long-term reliability of bonding.

 

(3) High insulation: Low-melting-point glass powder has high purity, low impurity content, stable performance, excellent electrical insulation performance, and can make the cured product have good insulation performance and arc resistance.

 

(4) Good matching: The product can match the expansion coefficient of the material, reduce the exothermic peak temperature of the resin curing reaction, reduce the linear expansion coefficient and shrinkage rate of the cured product, thereby eliminating the internal stress of the cured product, preventing cracking, stabilizing the product size, and enhancing the mechanical properties of the bonding part.

 

(5) Good dispersibility and compatibility: Low-melting-point glass powder has been specially treated and has good dispersibility in organic bonding systems such as resins. It is not easy to agglomerate and has good compatibility with various resins. It has good adsorption performance, is easy to mix, has no agglomeration phenomenon, and can be evenly distributed on the bonding interface, thereby improving the bonding effect.

 

 

Applications

 

(1) Electronic packaging: such as chip packaging, sealing of electronic devices, etc.

 

(2) Optical component bonding: used for bonding optical components such as optical lenses and optical fibers

 

(3) High-temperature coatings and paints: such as high-temperature coatings for barbecue stoves, fireplaces, gas stoves and combustion furnace metals, etc.

 

(4) Refractory material bonding: such as used as a transitional bonding material for refractory materials.

 

(5) Handicraft production: such as artificial diamonds, glass crafts, etc.

 

Storage conditions

Store in a cool, dry, ventilated warehouse; waterproof and sun-proof to prevent moisture and deterioration.

 

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